Numeric simulation of thickness of intermetallic compounds in interface zone of diffusion bonding for Cu and Al

摘要

Numeric model of intermetallic compound formation and growth in the vacuum diffusion bonding of copper and aluminum was established, and proved by EPMA and micro-hardness test etc. The numeric simulation of thickness of the intermetallic compound results in accord with the tests well. This study provides some references to determine welding parameters in the vacuum diffusion bonding of Cu/A1 dissimilar materials.