Deposition of Ti-Si-N coatings in deep blind-hole with pulsed dc power

摘要

Multiphase nanocomposite Ti-Si-N coatings deposited by pulsed dc plasma enhanced chemical vapor deposition technique on the surface of HSS substrate, which were bolted with deep blind-hole to simulate the complexshaped surface of various tools, were investigated. The micrographs show that the surface morphologies of the coatings become coarser with an increasing depth of the bottom holes. And the silicon content increases in Ti-Si-N coatings, which are composed of nanocrystalline TiN, nano-sized amorphous Si3N4, and occasionally amorphous or nanocrysralline TiSi2. The thickness of the coatings decreases with the increasing depth of holes, which may result from the changes of the composition in the coatings. The microhardness of the coatings increases firstly with the increasing depth of holes, reaches a maximum value of about HV5 700 at 10mm depth, and then decreases at larger depth.