Effect of bonding parameters on microstructure and properties of Si3N4/Si3N4 joint brazed by Cu-Zn-Ti filler alloy

摘要

Si3N4 ceramic was jointed to Si3N4 ceramic using a filler alloy of Cu-Zn-Ti at 1 123-1 323 K for 0.3 -2.7 ks. Ti content in the Cu-Zn-Ti filler alloy was 15% (molar fraction). The effect of bonding parameters on the microstructure and mechanical properties of the Si3N4/Si3N4 joint were investigated. The results indicate that with increasing brazing temperature from 1 123K to 1 323 K and brazing time from 0.3 ks to 2.7 ks, the thickness of the interfacial reaction layer between the filler alloy and the Si3 N4 ceramic and the size and amount of the reactant products in the filler alloy increase, leading to an increase in shear strength of the joint from 163 MPa to 276 MPa. It is also found that the fracture behavior of the Si3 N4/Si3 N4 joint greatly depends on the microstructure of the joint.