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Novel preparation of big bulk-nanocrystalline Cu in large quantities

             

摘要

The micrometer-sized Cu powder produced on commercial scale was compacted under pressure of 1.0?2.0 GPa and at room temperature,and the nanocrystalline(nc) Cu with diameter of 10 mm and thickness of 8 mm, relative density of 99.4% of the theoretical density for pure Cu (8.96 g/cm3), and mean grain size of 34?43 nm and microstrain of 0.16%?0.19% was obtained. The compacting process was analyzed with HUANG Pei-yun equation and the microstructure and properties of nc Cu were studied by XRD, SEM, PAS, MHV2000 mircrohardness tester and Datron 1081-type electrometer. The results show that the grain size of nc Cu samples is correlated with compacting pressure, the microhardness is 1.14?1.27 GPa which is about two times larger than that of the coarse-grained polycrystalline Cu, but the relationship between microhardness and grain size do not obey Hall-Petch equation strictly. The electrical resistivity of the specimens is 5.1×10?7Ω·m, larger than the coarse-grained Cu materials by a factor of 29, the mean lifetime of positron-annihilation is (172.8±0.8) ps. The cost of the method of fabrication for big-sized nc material is much lower than that of any others. This method has the advantages such as the lowest cost, largest output and volume as well as highest density over all other methods so far.

著录项

  • 来源
    《中国有色金属学报:英文版》 |2006年第4期|873-877|共5页
  • 作者单位

    School of Metallurgical Science and Engineering;

    Central South University;

    Changsha 410083;

    China Research Center of Laser Fusion;

    China Academy of Engineering Physics;

    Mianyang 621900;

    China;

    Research Center of Laser Fusion;

    China Academy of Engineering Physics;

    Mianyang 621900;

    China;

    Research Center of Laser Fusion;

    China Academy of Engineering Physics;

    Mianyang 621900;

    China School of Science and Engineering;

    Southwest University of Science and Technology;

    Mianyang 62 1010;

    China;

    School of Metallurgical Science and Engineering;

    Central South University;

    Changsha 410083;

    China;

  • 原文格式 PDF
  • 正文语种 chi
  • 中图分类 TG146.11;
  • 关键词

    铜; 纳米晶; 显微硬度; 电阻率; Hall-Petch方程;

    机译:纳米晶Cu合成方法显微硬度电阻率Hall-Petch方程;
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