电化学和水解-缩合方法制备具有防腐蚀和活化铜表面的多功能聚合纳米薄膜

摘要

A multifunctional polymeric nanofilm of triazinedithiolsilane monosodium salt, which can resist corrosion and activate copper surface concurrently, was prepared by galvanostatic technique and the following hydrolysis−condensation approach. Electrochemical tests were carried out to evaluate the resistant ability of nanofilm. The changes of functional groups atop the nanofilms were monitored with Fourier transform infrared spectroscopy (FT-IR) and contact angles (CA) simultaneously. The chemical composition and the morphology of the polymeric nanofilm were investigated by X-ray photoelectron spectroscopy (XPS) and scanning electron microscope (SEM), respectively. The results reveal that the preferentially developed disulfide units protect the copper during the whole preparation process, and the subsequently hydrolyzed nanofilms without/with heating shape into new interface phases bearing the multifunctionality. This multifunctional interface (the polymeric nanofilm on copper surface) opens up the possibilities for other OH-containing reagents to be anchored onto copper surface in demanding researches or industrial applications.%通过恒电流技术和水解−缩合方法，在铜表面制备均三嗪二硫醇硅烷单钠盐多功能聚合纳米薄膜，该纳米薄膜能够防腐蚀和活化铜表面。采用电化学测试来评价该薄膜的防腐蚀性能；用傅里叶变换红外光谱学(FT-IR)和接触角技术监测纳米薄膜表面功能团的变化；用 X 射线光电子能谱(XPS)及扫描电子显微镜(SEM)分别研究聚合纳米薄膜的化学组成和形貌特征。结果表明：在整个制备过程，电化学聚合形成的二硫单元优先保护铜表面；紧接的水解(缩合)作用使得该薄膜形成新的、具有防腐蚀和活化铜的多功能聚合纳米薄膜。该界面(聚合纳米薄膜)使得其他含有羟基的化合物可能在铜表面键合，且能够应用在高要求的研究和工业中。