LED 用有机硅导热垫片的制备及性能研究

摘要

A silicone thermal pad for LEDs was prepared by silicone resins as the basic material and the mixed Al( OH) 3/Al2 O3 particles as the thermal conductive fillers .Then its performance was tested .Results showed that the hardness of the pad was 10 Shore OO, the elongation was 450%and the thermal conductivity was 1.0 W/m・K.It was easy to compressive , and the thermal stability and surface adhesives were good , which could meet the performance requirements of thermal interface materials for LED .%以硅树脂为基料，氢氧化铝与氧化铝为导热填料，制得LED用有机硅导热垫片，测试了导热垫片的综合性能。结果表明，导热垫片邵尔OO硬度为10度，伸长率450％，热导率为1．0 W／m・ K，易于压缩变形，热稳定性及表面粘性好，能满足LED用导热界面材料的性能要求。