Micro Trace Resistive Technology

摘要

Micro trace resistive technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide.Using standard subtractive printed circuit board processes,it is ideal for high-density interconnect(HDI)designs where passive component placement is difficult or impossible.By utilizing the differential processes unique to the OhmegaPlynickel phosphorous(NiP)resistive material,copper traces can be imaged and etched to define resistor widths that are precise and sharply defined,resulting in the creation of miniature resistors with consistent ohmic values.With low inductance and good tolerances,micro trace resistors are ideal for line termination and pull-up/down applications.