贵金属键合丝材料的研究进展

摘要

贵金属键合丝是半导体封装的关键材柞之一，详细综述柚键合金丝、键合金银丝、键合银丝和镀钯键合铜丝的合金成分设计，制备工艺和发展现状，并展望柚其未来发展前景。%Precious metal bonding wire are one of key materials in semiconductor packaging. The alloy composition, preparation technology and research situation of Au bonding wire, Au-Ag bonding wire, Ag bonding wire and Pd-plated bonding Cu wire were summarized. In the meantime, the research prospect of precious metal bonding wire was also forecasted.