次流道对波状细通道热沉传热特性的影响及场协同效果分析

摘要

For the enhancement of integration level and calorific value of micro-electro-mechanical and microelectronics components, wave mini-channel heat sinks (WMS) which could enhance secondary flow of the fluid in mini-channel were designed.On the basis of this structure, the secondary flow passages were added to further improve its heat transfer characteristics.CFD software was used to simulate WMS with and without secondary passage and to investigate the effect on heat transfer in laminar flow state.The results showed that, as far as this study was concerned, when the Re of inlet fluid was less than 1008, the heat transfer characteristic of WMS with secondary passages was better than the one of WMS;secondary passages didn''t improve the temperature uniformity of mini-channel heat sink back surface.Then, through the analysis of the field synergy theory, it was found that secondary passages improved the synergy degree between velocity field and temperature field of wave mini-channel at the low Re, the heat transfer ability of WMS was improved.%针对微机电和微电子元件集成化程度提高和发热量骤增的问题,设计了一种可以增强流体二次流动程度的波状细通道热沉(WMS),并在此结构基础上增加次流道,以进一步提高其传热特性.使用CFD软件对有无次流道的WMS进行数值模拟,研究层流状态下次流道对WMS换热性能的影响,结果表明:在本研究范围内,进口流体Re<1008时,带次流道的WMS传热性能优于无次流道WMS;而次流道对细通道热沉底面温度分布均匀性几乎没有影响.通过场协同理论分析可知,低Re时,次流道可以改善WMS速度场与温度场的协同程度,提高WMS的传热能力.