Study on Integrated Thermal Cycle and Vibration Profile for HALT

摘要

Focusing on electronic products, this paper establishes a finite element model for printed circuit board (PCB) assembling with enhanced ball grid array(EBGA)component under vibration environment. Based on this model, it studies relations between fatigue rate of solder joint and temperature, vibration frequency. Moreover, it analyzes propagation of micro-crack produced by thermal cycle under vibration stress. The results offer a method to optimize the thermal cycle and vibration integrated profile and to combine vibration test and thermal cycling for highly accelerated life test (HALT).