Brief Review of Silver Sinter-bonding Processing for Packaging High-temperature Power Devices

摘要

Silver sintering is receiving increasing attention due to its novel die-attach technique for high-temperature power electronics.Excellent thermal conductivity,high melting point/remelting temperature and low-temperature sintering behaviors of the silver sintered attachment meet the requirements of high-temperature applications for power devices,specifically SiC devices.The merits and demerits of the existing pressure-assisted sintering and pressure-less sintering techniques using nano-scale,micro-scale and micro-nano-scale hybrid silver sintered materials are separately presented.The emerging rapid sintering approaches,such as the electric-assisted approach,are briefly introduced and the technical outlook is provided.In addition,the study highlights the importance of creating a brief resource guide on using the correct sintering methods.