首页> 中文期刊> 《中南大学学报》 >Thermal stress in SiC element used in heat exchanger

Thermal stress in SiC element used in heat exchanger

         

摘要

An especial snake SiC pipe was designed for collecting losing heat from furnaces. The three-dimensions thermal, fluid and thermal stress coupled field of heat exchanger was analyzed by using the commercial engineering computer package ANSYS. The structural and operational parameters of heat exchanger, the junction between standpipe and snake pipe, the diameter of snake pipe, ratio of thickness to diameter of pipe, velocity of inlet air were optimized for thermal stress. The computed results show that the large thermal stress exits in the SiC, and the stand pipe should be ellipse for the least thermal stress; the optimal ratio of thickness to diameter of pipe is 6, the velocity of inlet air is 25 m/s. The most thermal stress is in inverse proportion to diameter of pipe and velocity of inlet air.

著录项

获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号