Cu含量及纯度对Mo-Cu合金热物理性能的影响

摘要

研究了不同Cu含量及纯度对Mo-Cu合金热物理性能的影响规律。结果表明：随着Cu含量的增加，合金的热导率呈较为明显的增加趋势，且实测值均比理论值偏低，Cu含量不同偏差的比值也不同，这主要是由Cu含量的不同影响合金的烧结过程从而影响烧结体的致密度，Cu相纯度是Mo-Cu合金热导率的高敏感因素，当Cu纯度仅在99．8％-97％之间变动时，其热导率显著下降；随Cu含量的增加，合金的热膨胀系数也相应的增加，而Cu纯度对其热膨胀性能影响较小，随Cu纯度的下降只呈略微的上升波动趋势，但其值均在10×10-6／K以下，可达到热沉基片所封接的热匹配系数要求。%The effect of the different Cu content and purity on the thermal properties of Mo-Cu alloy was studied. The results show that the thermal conductivity （TC） of the alloys increases obviously with the increasing of Cu content, and the measured values of the TC are all lower than the calculated ones ,and the deviation ratio between two values is also different, this is mainly because that the process of sintering and relative density are also different when the adding Cu contents are different. Cu phase purity is the quite sensitive factor for the TC of alloys, and the TC decline evidently when the purity of copper are changing only within 99.8% ~ 97%. The coefficient of thermal expansion （CTE） of Mo-Cu alloy increase in corresponding with the adding of Cu ,but Cu purity have slightly impact on the changing Cu purity,and all below strate. of the CTE, and the CTE value is a little rising with the downgrading of the 10 × 10-6/K, so as to match the sealing requirements for heat sink sub-