首页> 中文期刊> 《国际设备工程与管理:英文版》 >Application of Wavelet Finite Element Method to Simulation of the Temperature Field of Copier Paper

Application of Wavelet Finite Element Method to Simulation of the Temperature Field of Copier Paper

         

摘要

Simulation of the temperature field of copier paper in copier fusing is very important for improving the fusing property of reprography. The temperature field of copier paper varies with a high gradient when the copier paper is moving through the fusing rollers. By means of conventional shaft elements, the high gradient temperature variety causes the oscillation of the numerical solution. Based on the Daubechies scaling functions, a kind of wavelet based element is constructed for the above problem. The temperature field of the copier paper moving through the fusing rollers is simulated using the two methods. Comparison of the results shows the advantages of the wavelet finite element method, which provides a new method for improving the copier properties.

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