将5,5′-二甲基乙内酰脲(DMH)新型无氰电镀体系应用于惯性约束聚变金空腔靶制备中.利用扫描电镜和库仑计法研究了以DMH为配位剂的镀液组成和工艺条件对电镀金层质量等的影响.结果表明:该镀液体系具有良好的稳定性,控制镀液中金盐质量浓度为8g/L,DMH质量浓度为80g/L时,在阴极电流密度1.5A/dm2、pH值9～10、温度45℃的条件下,可制得结晶致密、厚度均一的金镀层.%Gold plating using DMH as complexing agent has been applied to hohlraum target. The effects of bath compositions and operating conditions on gold plating quality were investigated by scanning electron microscopy and coulometric measurement. The results show that the gold plating bath is stable. Uniform and compact gold deposits are formed in the bath containing 8 g/L gold salt and 80 g/L DMH at the cathode current density of 1. 5 A/dm2, pH level of 9-10 and bath temperature of 45 ℃.
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