首页> 中文期刊>工程(英文)(1947-3931) >Study of Ni/Al Interface Diffusion by Molecular Dynamics Simulation

Study of Ni/Al Interface Diffusion by Molecular Dynamics Simulation

     

摘要

Molecular dynamics simulation of Ni/Al interface diffusion is carried out by Embedded Atom Method (EAM) potential. The problem how the temperature affects Ni/Al interface diffusion is discussed. The initial dynamic behavior of Ni/Al interface diffusion at high temperature is shown. The study in this letter is helpful to understand the origin of diffusion phenomenon.

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