The rapid development of the electronic information industry brings to the irreplaceable role of electronic components, therefore the search of a more reliable packaging material has become increasingly important. In the electronic packaging system, the failure phenomenon caused by residual stress is one of the key factors restricting the development of electronic packaging technology. In order to use the in-situ characterization technology to explore the residual stress inducing mechanism and failure mechanism of epoxy-based advanced packaging materials, this paper gives a review of related previous research, and lays a theoretical foundation for the upcoming research. The classification and generation mechanism of residual stress are clarified in this paper, which provides data support for future related research.
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机译:New Sensor and Actuator Networks Research from University of Electronic Science and Technology of China Described (Recent Advances in Time-Sensitive Network Configuration Management: A Literature Review)
机译:Recent Advances in the Prediction of Weld Residual Stress and Distortion Part 1 A comprehensive review of the numerical modeling theory and methods for predicting weld residual stress and distortion