首页> 中文期刊> 《中国物理快报:英文版》 >Reduction of Reactive-Ion Etching-Induced Ge Surface Roughness by SF6/CF4 Cyclic Etching for Ge Fin Fabrication

Reduction of Reactive-Ion Etching-Induced Ge Surface Roughness by SF6/CF4 Cyclic Etching for Ge Fin Fabrication

         

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  • 来源
    《中国物理快报:英文版》 |2015年第4期|69-72|共4页
  • 作者单位

    School of Electronic Science and Engineering, Nanjing University, Nanjing 210093;

    Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027;

    Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027;

    School of Electronic Science and Engineering, Nanjing University, Nanjing 210093;

    School of Electronic Science and Engineering, Nanjing University, Nanjing 210093;

    Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027;

    State Key Lab of Silicon Materials, Zhejiang University, Hangzhou 310027;

  • 原文格式 PDF
  • 正文语种 eng
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