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Effect of Mn doping on mechanical properties and electronic structure of WCoB ternary boride by first-principles calculations

机译:Mn掺杂对WCoB三元硼化物力学性能和电子结构的影响

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摘要

The first-principles calculations are performed to investigate the structural, mechanical property, hardness, and elec-tronic structure of WCoB with 0, 8.33, 16.67, 25, and 33.33 at.%Mn doping content and W2CoB2 with 0, 10, and 20 at.%Mn doping content. The cohesive energy and formation energy indicate that all the structures can retain good structural stability. According to the calculated elastic constants, Mn is responsible for the increase of ductility and Poisson's ratio and the decrease of Young's modulus, shear modulus, and bulk modulus. By using the population analysis and mechani-cal properties, the hardness is characterized through using the five hardness models and is found to decrease with the Mn doping content increasing. The calculated electronic structure indicates that the formation of a B–Mn covalent bond and a W–Mn metallic bond contribute to the decreasing of the mechanical properties.
机译:进行第一性原理计算,以研究Mn掺杂量为0、8.33、16.67、25和33.33 at。%的WCoB的结构,力学性能,硬度和电子结构,以及掺杂0、10和20的W2CoB2锰含量至少为%。内聚能和地层能表明,所有结构均可保持良好的结构稳定性。根据计算出的弹性常数,Mn引起延性和泊松比的增加,杨氏模量,剪切模量和体积模量的降低。通过总体分析和力学性能,通过使用五个硬度模型对硬度进行了表征,发现硬度随Mn掺杂含量的增加而降低。计算得出的电子结构表明,B-Mn共价键和W-Mn金属键的形成有助于降低机械性能。

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  • 来源
    《中国物理:英文版》 |2018年第10期|519-530|共12页
  • 作者单位

    Collaborative Innovation Center of Steel Technology, University of Science and Technology Beijing, Beijing 100083, China;

    Beijing Key Laboratory of Materials Genome Initiative, University of Science and Technology Beijing, Beijing 100083, China;

    Collaborative Innovation Center of Steel Technology, University of Science and Technology Beijing, Beijing 100083, China;

    Beijing Key Laboratory of Materials Genome Initiative, University of Science and Technology Beijing, Beijing 100083, China;

    Collaborative Innovation Center of Steel Technology, University of Science and Technology Beijing, Beijing 100083, China;

    Collaborative Innovation Center of Steel Technology, University of Science and Technology Beijing, Beijing 100083, China;

    Beijing Key Laboratory of Materials Genome Initiative, University of Science and Technology Beijing, Beijing 100083, China;

    Kennametal Inc, 1600 Technology Way, PA 15650, USA;

  • 收录信息 中国科学引文数据库(CSCD);中国科技论文与引文数据库(CSTPCD);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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