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High holding voltage SCR for robust electrostatic discharge protection

机译:高保持电压SCR可提供强大的静电放电保护

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摘要

A novel silicon controlled rectifier (SCR) with high holding voltage (Vh) for electrostatic discharge (ESD) protection is proposed and investigated in this paper.The proposed SCR obtains high Vh by adding a long N+ layer (LN+) and a long P+ layer (LP+),which divide the conventional low voltage trigger silicon controlled rectifier (LVTSCR) into two SCRs (SCRI:P+/Nwell/Pwell/N+ and SCR2:P+/LN+/LP+/N+) with a shared emitter.Under the low ESD current (IESD),the two SCRs are turned on at the same time to induce the first snapback with high Vh (Vh1).As the IESD increases,the SCR2 will be turned off because of its low current gain.Therefore,the IESD will flow through the longer SCR1 path,bypassing SCR2,which induces the second snapback with high Vh (Vh2).The anti-latch-up ability of the proposed SCR for ESD protection is proved by a dynamic TLP-like (Transmission Line Pulse-like) simulation.An optimized Vh2 of 7.4 V with a maximum failure current (It2) of 14.7 mA/μm is obtained by the simulation.
机译:提出并研究了一种新型的具有高保持电压(Vh)的可控硅整流器(SCR),用于静电放电(ESD)保护。该SCR通过添加一个长N +层(LN +)和一个长P +层来获得高Vh。 (LP +),它将传统的低压触发可控硅整流器(LVTSCR)分为两个SCR(SCRI:P + / Nwell / Pwell / N +和SCR2:P + / LN + / LP + / N +),并具有共用的发射极。电流(IESD)时,两个SCR同时导通以引起第一个具有高Vh(Vh1)的骤回。随着IESD的增加,SCR2将因其低电流增益而关闭。因此,IESD将流过较长的SCR1路径并绕过SCR2,从而引起第二个高Vh(Vh2)的骤回。建议的SCR用于ESD保护的抗闩锁能力通过类似动态TLP(类似于传输线脉冲)的方式来证明通过仿真得到优化的7.4 V Vh2,最大故障电流(It2)为14.7 mA /μm离子。

著录项

  • 来源
    《中国物理:英文版》 |2017年第7期|346-351|共6页
  • 作者单位

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China;

  • 收录信息 中国科学引文数据库(CSCD);中国科技论文与引文数据库(CSTPCD);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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