机译:使用磁光成像技术的新型焊接接头微观结构检查
School of Electromechanical Engineering, Guangdong University of Technology, Guangdong 510006, China;
School of Electromechanical Engineering, Guangdong University of Technology, Guangdong 510006, China;
School of Electromechanical Engineering, Guangdong University of Technology, Guangdong 510006, China;
Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan;