贵金属钎料在电子工业、微电子封装、真空多级钎焊、高温技术、饰品制造业及航空航天等诸多领域占据重要地位,金/钯基贵金属钎料的研发及应用一直是国内外研究的热点.详细介绍工业生产、军工及民用等领域中常用的低/中/高温金基钎料,电子工业分级钎焊用、高温耐热型和具备特殊性能的钯基钎料,总结各个系列钎料特点、钎焊性能及用途,并简单概述银基钎料特性.综合评述贵金属钎料发展和应用中出现的加工性能差、经济成本高、含致毒污染元素、焊点可靠性不理想及模拟基础数据库匮乏等问题,从制备工艺、微合金化、添加强化相、匹配助焊剂和钎料计算机模拟等方面展望贵金属钎料未来发展趋势,并从中寻求对现存问题的解决措施,为贵金属钎料的开发、应用及推广提供基础支撑.%Precious metal solders occupy an important position in the electronics industry, microelectronic packaging, multi-stage vacuum brazing, high temperature technology, jewelry manufacturing, aerospace industry and other fields, the development and applications of gold/palladium based solders is the focus both home and abroad. The low/medium/high temperature gold-based solders which were commonly used in industrial production, military and civil fields were described particularly, as well as the presentation of the palladium-based brazing filler metals for the electronics industry classification brazing, high temperature resistant and special functions, besides that, the characteristics, properties and applications of each series of solders were summarized, and there is a brief overview for the properties of silver-based brazing filler metals. Problems still exist in poor processing performance, high economic costs, toxic elements pollution,lack of basic database of simulation, low reliability of solder joint etc. Accordingly, the future trend of precious metal solders was prospected and solutions to existing problems were seeked mainly from the preparation process, the micro-alloying, adding strengthening phase, matching solder flux, computer simulation and other aspects, which also provides a basic support for the development, application and promotion of precious metal solders.
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