一种实用的 PECVD 腔体检漏工具设计方法

摘要

在 TFT-LCD 行业,PECVD 设备主要用于 Array TFT 基板工艺中的气相沉积；产生的非金属膜层,为金属电路提供保护、开关作用；在 PECVD 工艺制程中,腔体设计复杂,反应条件苛刻,产生的制程物会造成产品不良,故需要定期进行 PM(pre maintenance 预防性维护)。本文以 PECVD PM 作业为背景,针对设备 PM 耗时长的问题,制定了改善方法,并着重介绍了腔体检漏工具的设计过程。设计制作了一台国产化检漏工具,成功运用于量产。通过测试,检漏工具3 min 内达到10 mT(1 mT＝0．133 Pa),漏率为0．45 mT/min,基本符合设备 Spec．(标准)要求。%In TFT - LCD industry,PECVD equipment is mainly used for the vapor deposition in the process of Array TFT to produce non-metal film layer,which protects and switches metal circuit .In PECVD process,cavity design is complex and reaction conditions are harsh,the process will lead to bad products,so we need to do pre-maintenance on a regular basis.On the background of PECVD PM,we improved the method and emphatically introduced the cavity check-up leak tool design process because of the time-consuming of PM.We designed a domestic leak detection tool,and applied it into mass producing successfully.Final test results showed that pressure reached to 10 mT in 3 min and the leakage rate is 0.45 mT/min,which accord with the equipment standard.