树形微通道热沉仿生建模及三维热流特性数值分析

摘要

The microstructures of several typical leaves were measured and analyzed to get the di-ameter,angle and diameter ratio for each levels of leaf vein.The CAD model and simulation of heat and flow in a two-layer dendritic microchannel network for chips cooling were conducted.The simula-tion results show that the temperature distribution is more uniform in the tree-like microchannel than that in the paralell microchannel.The temperature and pressure drop are lower in the tree-like micro-channel with 7 level branches than that with 6 and 8 level branches.%对几种典型树叶进行参数测量,获得了各级叶脉直径、交角值及直径比例关系,在此基础上建立了树形微通道热沉的CAD模型,并对不同分形级数的双层微通道系统内的温度和流动特性分布进行了数值分析。结果表明,树形微通道具有更好的均温性,7级分形的树形微通道与6级和8级分形的树形微通道相比,所冷却芯片的温度更低,压降更小,具有更好的冷却效果。