TC11电子束焊接接头组织分析

摘要

以20mm厚TC11电子束焊接试样为研究对象,进行金相分析和显微硬度测试.对20mm板厚TC11钛合金电子束焊接接头组织及显微硬度进行了分析研究.比较分析了接头的焊缝、热影响区及各过渡界面的组织状态,并对不同组织的形成机理进行了阐释.%The 20mm-thick TC11 titanium alloy EBW jiont microstructure is analysised by metallography and microhardness test. Microstructure of welded seam, heating affected zone and transition interface are compared and the generation mechanism of different struc-turesis elucidated.