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Structure and mechanism of human DNA ligase III, an essential repair enzyme.

机译:人类DNA连接酶III(必不可少的修复酶)的结构和机制。

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摘要

DNA ligase III is one of three human DNA ligases responsible for repairing breaks in the backbone of DNA, which if left unrepaired can lead to genomic instability, cancer and symptoms related to accelerated aging. Understanding the recruitment of DNA ligase III to DNA is essential to understanding the regulation of DNA repair in vivo. DNA ligase III contains a unique N-terminal zinc finger domain that binds to nicks and gaps in DNA. This small domain has been described as a nick sensor, but it is not required for DNA nick joining activity in vitro. Recent structural studies of other human DNA ligases identified other domains in DNA ligase III that potentially participate in DNA binding and nick recognition.; This dissertation describes the DNA binding and ligation activities of human DNA ligase III. The DNA binding affinity and specificity of each domain of DNA ligase III were measured using biochemical methods. These studies identified two separate, independent DNA binding modules in DNA ligase III that each bind specifically to nicked DNA over intact duplex DNA. Both binding modules are required for ligation of blunt ended DNA substrates. Although the zinc finger increases the catalytic efficiency of nick ligation, it appears to occupy the same binding site as the DNA ligase III catalytic core. Crystallization of a zinc finger deletion mutant showed that DNA ligase III fully encircles the DNA and sequesters the nick in the enzyme active site, presumably to the exclusion of the zinc finger. This suggests that the zinc finger functions at an earlier step of end joining, initially serving to recruit DNA ligase III to the site of a nick in DNA then disengaging to allow access by the other domains during the subsequent reactions (DNA adenylation and nick ligation) that join the ends of the DNA together. These structural and mechanistic studies explore the molecular properties of DNA Ligase III involved in its recruitment to specific sites of DNA damage, and offer insight into the coordination of DNA repair transactions in vivo.
机译:DNA连接酶III是负责修复DNA骨架断裂的三种人类DNA连接酶之一,如果不进行修复,会导致基因组不稳定,癌症以及与衰老有关的症状。了解DNA连接酶III向DNA的募集对于了解体内DNA修复的调控至关重要。 DNA连接酶III包含一个独特的N末端锌指结构域,该结构域与DNA的切口和缺口结合。该小域已被描述为切口传感器,但对于体外DNA切口连接活性不是必需的。最近对其他人类DNA连接酶的结构研究确定了DNA连接酶III中可能参与DNA结合和缺口识别的其他结构域。本文描述了人类DNA连接酶III的DNA结合和连接活性。使用生化方法测量DNA连接酶III的每个结构域的DNA结合亲和力和特异性。这些研究确定了DNA连接酶III中的两个独立的独立DNA结合模块,每个模块都与完整的双链DNA上的切口DNA特异性结合。连接两个平末端DNA底物都需要两个结合模块。尽管锌指提高了切口连接的催化效率,但它似乎占据了与DNA连接酶III催化核心相同的结合位点。锌指缺失突变体的结晶表明,DNA连接酶III完全包围了DNA,并隔离了酶活性位点的缺口,推测是排除了锌指。这表明锌指在末端连接的较早步骤中起作用,最初用于将DNA连接酶III募集到DNA中一个缺口的位点,然后在随后的反应(DNA腺苷酸化和缺口连接)中脱离以允许其他结构域进入将DNA的末端连接在一起。这些结构和机理研究探索了DNA Ligase III的分子特性,该分子参与将其募集到DNA损伤的特定位点,并为体内DNA修复交易的协调提供了见识。

著录项

  • 作者

    Cotner, Elizabeth Anne.;

  • 作者单位

    Harvard University.;

  • 授予单位 Harvard University.;
  • 学科 Chemistry Biochemistry.
  • 学位 Ph.D.
  • 年度 2008
  • 页码 124 p.
  • 总页数 124
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 生物化学;
  • 关键词

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