A Physics-Based Approach for Power Integrity in Multi-Layered PCBs

摘要

Developing a power distribution network (PDN) for ASICs and ICs to achieve the low-voltage ripple specifications for current digital designs is challenging with the high-speed and low-voltage ICs. Present methods are typically guided by best engineering practices for low impedance looking into the PDN from the IC. A pre-layout design methodology for power integrity in multi-layered PCB PDN geometry is proposed in the thesis. The PCB PDN geometry is segmented into four parts and every part is modelled using different methods based on the geometry details of the part. Physics-based circuit models are built for every part and the four parts are re-assembled into one model. The influence of geometry details is clearly revealed in this methodology. Based on the physics-based circuit mode, the procedures of using the pre-layout design methodology as a guideline during the PDN design is illustrated. Some common used geometries are used to build design space, and the design curves with the geometry details are provided to be a look up library for engineering use.;The pre-layout methodology is based on the resonant cavity model of parallel planes for the cavity structures, and parallel-plane PEEC (PPP) for the irregular shaped plane inductance, and PEEC for the decoupling capacitor connection above the top most or bottom most power-return planes. PCB PDN is analyzed based on the input impedance looking into the PCB from the IC. The pre-layout design methodology can be used to obtain the best possible PCB PDN design. With the switching current profile, the target impedance can be selected to evaluate the PDN performance, and the frequency domain PDN input impedance can be used to obtain the voltage ripple in the time domain to give intuitive insight of the geometry impact on the voltage ripple.