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Experimental and Simulation Approaches for Optimizing the Thermal Performance of Building Enclosures Containing Phase Change Materials.

机译:用于优化包含相变材料的建筑围护结构热性能的实验和模拟方法。

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摘要

It has been proven that the integration of phase change materials (PCM) into building enclosures helps with wall thermal management as well as in reducing building energy consumption. Most older and some current PCM integration methods for building enclosures are impractical and create problems such as PCM leakage and evaporation, PCM water absorption, moisture transfer problems leading to building materials degradation, and problems related to the improper mixing of PCMs with insulation products (e.g., cellulose insulation). The use of thin PCM layers assembled and contained in blanket-like or board products would be practical to install and would eliminate or ameliorate these problems.;The integration of thin PCM layers into building enclosure components, such as walls and ceilings, was accomplished via the use of thin PCM thermal shields (PCM shields) and via thin PCM boards. The thermal performance of building enclosures integrated with PCM shields and PCM boards was studied using experimental and simulation methods. For the experiments, the PCM shields were tested in the test houses of typical residential construction and the PCM boards were tested in the institutional building of commercial construction. For the modeling and simulations, a public-domain building energy simulation software, known as EnergyPlus, that included a new open-source algorithm, known as CondFD, was used. For model calibration purposes, the model predictions were compared against experimental data.;From the experimental evaluation of the PCM shields, it was observed that their thermal performance depended on their installation location within the cavities of the walls and ceilings. Therefore, a critical part of this research was to discover which installation location would produce the optimal performance of an enclosure outfitted with PCM shields.For this, several locations, measured from the interior surface of the wallboard which was in contact with the conditioned space, were specified as locations 1, 2, 3, 4, and 5. The location number increased with distance from the surface indicated in the preceding sentence. It was discovered that in terms of peak heat fluxes, the integration of PCM shields in enclosure components produced the maximum percent reductions of 57.4% when installed at location 3 (i.e., in the middle of the wall cavity) in a south-facing wall, 37.3% when installed at location 2 in a west-facing wall, and 41.1% when installed at location 4 in a ceiling. In terms of daytime total heat transfer, the integration of PCM shields produced the maximum percent reductions of 47.9% for location 3 for a south wall, 34.1% for location 3 for a west wall, and 27.5% for location 4 for a ceiling.;The PCM boards were installed in a single location over the internal surface of the indoor surface that bound the walls of the institutional building. The results indicated that the addition of the PCM boards to a standard wall panel would produce reductions in peak heat flux of 67.0% for a south wall panel and 80.2% for a west wall panel. In terms of total heat transfer, the integration of the PCM boards produced average daily reductions of 27.4% in the south wall and 10.5% in the west wall.;For evaluating overall energy savings produced by the integration of PCM shields into building walls and ceilings, simulations of a typical residential building with and without PCM shields were carried out for a building located in four cities, which were selected according to the DOE Climate Zone Map and included climate zones 1 - 4. The simulations predicted that the optimal installation location of the PCM shield would be location 2 for both the walls and ceilings of the residential building regardless of city location. Furthermore, it was discovered that PCM installation at location 1 in any enclosure component should be avoided because the heat transfer, and thus the energy consumption, in the cooling and heating seasons would both increase.
机译:业已证明,将相变材料(PCM)集成到建筑物外壳中有助于墙体热量管理以及减少建筑物能耗。用于建筑物外壳的大多数较旧的和当前的PCM集成方法不切实际,并会产生诸如PCM泄漏和蒸发,PCM吸水,导致建筑材料降解的水分传递问题以及与PCM与绝缘产品混合不当相关的问题(例如, ,纤维素绝缘)。使用组装并包含在毛毯状或木板产品中的PCM薄层将很容易安装,并且可以消除或改善这些问题。通过将PCM薄层集成到建筑物的外壳组件(如墙壁和天花板)中,可以实现以下目的:使用薄的PCM隔热板(PCM防护板)和通过薄的PCM板。使用实验和模拟方法研究了集成了PCM屏蔽层和PCM板的建筑物外壳的热性能。对于实验,PCM屏蔽层在典型住宅建筑的测试房屋中进行了测试,而PCM板在商业建筑的机构建筑中进行了测试。对于建模和模拟,使用了一个称为EnergyPlus的公共领域建筑能耗模拟软件,其中包括一个称为CondFD的新开源算法。为了进行模型校准,将模型预测值与实验数据进行了比较。;从PCM屏蔽层的实验评估中,可以看出它们的热性能取决于其在墙壁和天花板腔体内的安装位置。因此,这项研究的关键部分是发现哪个安装位置可以使配备PCM屏蔽罩的机柜发挥出最佳性能。为此,从墙板与受调节空间接触的内表面开始测量几个位置,被指定为位置1、2、3、4和5。位置编号随着与前一句中指示的表面距离的增加而增加。已经发现,就峰值热通量而言,将PCM屏蔽罩集成到外壳组件中时,将其安装在朝南的墙的位置3(即墙腔的中间)时,可以最大程度地降低57.4%,安装在朝西的墙壁中的位置2处为37.3%,安装在天花板上的位置4处为41.1%。就日间总传热而言,PCM屏蔽的集成最大减少百分比为南墙3号位置为47.9%,西墙3号位置为34.1%,天花板4号为27.5%。 PCM板安装在限制机构建筑物墙壁的室内表面内表面上的单个位置中。结果表明,将PCM板添加到标准墙板中会使南墙板的峰值热通量减少67.0%,西墙板的峰值热通量减少80.2%。在总传热方面,PCM板的集成使南墙平均每日减少27.4%,西墙平均每日减少10.5%;用于评估将PCM屏蔽层集成到建筑物墙壁和天花板中所产生的总体节能效果,针对位于四个城市的建筑物进行了带和不带PCM屏蔽的典型​​住宅建筑的模拟,这些建筑是根据DOE气候区图选择的,其中包括1-4个气候区。模拟预测,最佳安装位置为PCM屏蔽层将位于住宅建筑物的墙壁和天花板上的位置2,而与城市位置无关。此外,已发现应避免在任何外壳组件中的位置1处安装PCM,因为在制冷和加热季节中的热传递以及能耗都会增加。

著录项

  • 作者

    Lee, Kyoung Ok.;

  • 作者单位

    University of Kansas.;

  • 授予单位 University of Kansas.;
  • 学科 Engineering Civil.;Engineering Environmental.;Engineering General.
  • 学位 Ph.D.
  • 年度 2014
  • 页码 235 p.
  • 总页数 235
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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