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AC impedance studies on copper deposition and aluminum electrolysis.

机译:交流阻抗研究,涉及铜沉积和铝电解。

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The influences of cathodic potential and surface roughness on copper deposition on a rotating cylindrical electrode from a copper sulfate/sulfuric acid bath were studied experimentally and theoretically using electrochemical impedance analysis. The influence of methylthiourea, a sulfur containing organic compound often added to sulfate bath for the purpose of improving the physical properties of deposited copper, on copper deposition onto a copper electrode was investigated. In aluminum electrolysis, the evaluation of the inert anode, the development of which is important for the aluminum industry, was tried using electrochemical impedance analysis and cyclic voltammetry. Four anode materials were tested: carbon, platinum, cermet, and SnO{dollar}sb2{dollar}.; The rate determining step of copper deposition was determined through Nyquist impedance plots as a function of cathodic potential. At low cathodic potentials ({dollar}-{dollar}60 mV and {dollar}-{dollar}110 mV), the total rate was controlled by the redox reaction of cupric ion, while mass transfer, the diffusion of cupric ion to electrode surface, became the rate determining step at high cathodic potentials ({dollar}-{dollar}200 mV and {dollar}-{dollar}250 mV). The modeling of the impedance behavior agreed with experimental results. The change of effective surface area of electrode due to surface roughness was monitored through impedance diagrams.; The addition of methylthiourea to the sulfate bath reduced the cathodic current and changed the current-voltage relation. A passivation-like phenomenon related to the adsorption of methylthiourea on the cathodically charged electrode was observed. The passivation-like phenomenon, demonstrated in cyclic voltammograms and impedance plots, was established to occur in the potential range of {dollar}-{dollar}150 mV to {dollar}-{dollar}260 mV, above 0.3 M cupric sulfate, and with methylthiourea concentration higher than 0.005 g/l. The impedance diagram was shown to be a sensitive indicator often whether effective conditions for electroplating were present in the bath.; Platinum, cermet, and SnO{dollar}sb2{dollar} electrodes showed lower anodic overpotentials than the carbon anode presently used as an anode in aluminum production. The reaction of combining the aluminate ion with carbon to produce carbon dioxide was the rate determining step in carbon anode with saturated alumina. The mass transfer of aluminate ion controlled the total rate in cases of platinum, cermet, and SnO{dollar}sb2{dollar} anodes but in SnO{dollar}sb2{dollar}, the charge transfer reaction was not negligible at high current density (26.8 mA/cm{dollar}sp2{dollar}). Cermet was found to be a promising practical inert anode material since it was chemically stable due to the copper oxide film and its electrical conductivity was relatively high.
机译:利用电化学阻抗分析,从理论和实验上研究了阴极电位和表面粗糙度对硫酸铜/硫酸浴中旋转圆柱电极上铜沉积的影响。研究了甲基硫脲(一种经常添加到硫酸盐浴中以改善沉积铜的物理性能的含硫有机化合物)对铜在铜电极上沉积的影响。在铝电解中,使用电化学阻抗分析和循环伏安法尝试评估惰性阳极的发展,这对铝工业至关重要。测试了四种阳极材料:碳,铂,金属陶瓷和SnO {sb2}。通过Nyquist阻抗图确定铜沉积的速率确定步骤,作为阴极电位的函数。在低阴极电位下({dollar}-{dollar} 60 mV和{dollar}-{dollar} 110 mV),总速率受铜离子的氧化还原反应控制,而传质,铜离子向电极的扩散表面,成为高阴极电位({dollar}-{dollar} 200 mV和{dollar}-{dollar} 250 mV)下的速率决定步骤。阻抗行为的建模与实验结果一致。通过阻抗图监测由于表面粗糙度引起的电极有效表面积的变化。在硫酸盐浴中添加甲硫脲可减少阴极电流并改变电流-电压关系。观察到与甲硫脲在阴极带电电极上的吸附有关的钝化现象。在循环伏安图和阻抗图中证明的类似钝化的现象被确定为发生在{m} -150 mV到260 mV的电位范围内,高于0.3 M硫酸铜,以及甲硫脲浓度高于0.005克/升。阻抗图被显示为敏感指示器,通常表明镀液中是否存在有效的电镀条件。与目前在铝生产中用作阳极的碳阳极相比,铂电极,金属陶瓷和SnO {sb2 {dollar}}电极显示出较低的阳极过电势。铝酸盐离子与碳结合产生二氧化碳的反应是碳阳极与饱和氧化铝的速率确定步骤。在铂,金属陶瓷和SnO {sb2 {dollar}阳极的情况下,铝酸根离子的传质控制了总速率,但在SnO {sal2sb2 {dollar}阳极中,电荷转移反应在高电流密度下不可忽略( 26.8 mA / cm {美元} sp2 {美元})。金属陶瓷被发现是一种有前景的实用惰性阳极材料,因为它由于氧化铜膜而在化学上稳定并且其电导率相对较高。

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