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Ultrasonic evaluation of interfacial properties in imperfect anisotropic layered substrates.

机译:超声评估不完美各向异性层状基材中的界面特性。

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摘要

Interface conditions in layered substrates are critical to the performance of these materials. Most studies of interface conditions in layered substrates are confined to the extreme cases and give no details about the intermediate cases. In this study the lowest order mode of the generalized Lamb wave was used to examine the interfacial properties of imperfect layered substrates. Anisotropic specimens of various configurations with controlled interface conditions were made with a meshed intervening layer technique. It was noted that at very low and very high frequencies the effect of anisotropy on the dispersion curve in a silicon layered substrate was significant. The results also showed that the position of the turning point in the dispersion curve was sensitive to bond quality variation. As the quality of bonding decreased, this turning point shifted toward low velocities and frequencies and finally resembled that of the completely misbonded case. Furthermore, empirical formulae which relate the stiffness constant and the position of the turning point for a partially bonded material were also obtained. It is noteworthy that the position of the turning point does not vary significantly with orientation. By incorporating an effective interface layer into a multiple layer formulation and comparing the calculated results with the experimental data, the interfacial properties of the layered substrate were evaluated. Moreover, the shape of the dispersion curve of this lowest order mode was found to be dependent on the bond quality and anisotropy, but the dominating factor was the bond quality. Therefore, the turning point in the dispersion curve of the lowest order mode may be used to assess bond quality in an anisotropic layered substrate.
机译:层状基材中的界面条件对于这些材料的性能至关重要。层状基材中界面条件的大多数研究仅限于极端情况,而没有提供有关中间情况的详细信息。在这项研究中,广义兰姆波的最低阶模式被用来检查不完善层状基底的界面特性。用网状中间层技术制作了具有受控界面条件的各种结构的各向异性试样。注意到在非常低和非常高的频率下,各向异性对硅层状衬底中的色散曲线的影响是显着的。结果还表明,色散曲线中转折点的位置对键合质量变化敏感。随着键合质量的下降,该转折点转向低速和低频率,并最终类似于完全错误键合的情况。此外,还获得了与刚度常数和部分粘结材料的转折点位置相关的经验公式。值得注意的是,转折点的位置不会随方向变化很大。通过将有效的界面层并入多层配方中,并将计算结果与实验数据进行比较,评估了层状基材的界面性能。此外,发现该最低阶模式的色散曲线的形状取决于键质量和各向异性,但是主要因素是键质量。因此,最低阶模式的色散曲线中的转折点可用于评估各向异性层状基板中的键合质量。

著录项

  • 作者

    Ko, Ray-Tse.;

  • 作者单位

    The Ohio State University.;

  • 授予单位 The Ohio State University.;
  • 学科 Physics.;Aerospace engineering.;Materials science.;Acoustics.
  • 学位 Ph.D.
  • 年度 1993
  • 页码 183 p.
  • 总页数 183
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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