Sensors and data acquisition system for materials processing.

摘要

Transfer molding is the primary method for packaging semiconductor devices. This work examines revolutionary monitoring techniques of transfer molding. The first perspective is monitoring pressure of thermoset plastic in the mold cavity and at the ram tip using Dynisco pressure transducers. This demonstrates a method for elicit molding parameters directly. The second is a theoretical design and proposed implementation of a semiconductor micro transducer to monitor pressure and temperature of plastic encapsulant. This microtransducer uses SIMOX technology to yield a semiconductor device capable of operating in and around 175{dollar}spcirc{dollar}C.