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Three dimensional electromagnetic FDTD simulation of general lossy structures with nonuniform grid spacing.

机译:具有不均匀网格间距的一般有损结构的三维电磁FDTD模拟。

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A new second order accurate nonuniform grid spacing technique which does not depend on supraconvergence is developed for Finite Difference Time Domain (FDTD) simulation of general three dimensional structures. The technique is useful for FDTD simulations of systems which require finer details in small regions of the simulation space by providing the ability to utilize nonuniform grid spacing. The stability conditions of the new technique are derived and shown to be consistent with uniform grid formulation and the accuracy of the technique is investigated and shown to be second order. The advantage of the new technique is that it allows for greater simulation detail while reducing the computational and memory requirements compared to the current uniform grid FDTD techniques.; Additionally, the derivation of the expressions associated with the inclusion of material properties in the FDTD simulation with nonuniform grids is presented allowing for the development of a nonuniform FDTD simulator for general lossy 3D systems associated with on and off chip interconnects, electronic packages and microwave circuits. In order to illustrate the utility of this simulator, time domain electromagnetic simulation of a 3-D lossy interconnect structure associated with a generic surface mount IC package is presented. The time domain currents and fields are computed in the structure to investigate ground bounce, signal degradation, and crosstalk associated with the interconnects and packaging structure. The supply plane conductivities are included in the simulation allowing the observation of the current densities in the power/ground planes as a function of time.; Finally, the FDTD simulation tool is proposed and used as a Virtual TDR (V-TDR) to extract the circuit models associated with complex 3D structures. The time domain response of a multiport structure is used to extract the equivalent circuit parameters to characterize the multiport by using the multiport time domain reflection (TDR) based general deconvolution algorithm. Examples of coupled interconnects and transmission lines are presented to illustrate this technique.
机译:开发了一种不依赖超收敛的新型二阶精确非均匀网格间距技术,用于一般三维结构的时差有限差分(FDTD)仿真。通过提供利用非均匀网格间距的能力,该技术可用于需要在仿真空间的较小区域中提供更详细信息的系统的FDTD仿真中。推导了该新技术的稳定性条件,并证明其与均匀网格公式一致,并且对该技术的准确性进行了研究并显示为二阶。与当前的统一网格FDTD技术相比,新技术的优势在于它允许更多的仿真细节,同时减少了计算和内存需求。此外,还提出了在具有不均匀网格的FDTD仿真中与材料属性包含相关的表达式的推导,从而允许开发用于与芯片上和芯片外互连,电子封装和微波电路相关的通用有损3D系统的FDTD不均匀模拟器。 。为了说明此仿真器的实用性,提出了与通用表面贴装IC封装相关联的3-D有损互连结构的时域电磁仿真。在结构中计算时域电流和场,以研究接地反弹,信号衰减以及与互连和封装结构相关的串扰。电源平面电导率包含在仿真中,允许观察电源/接地平面中的电流密度随时间的变化。最后,提出了FDTD仿真工具,并将其用作虚拟TDR(V-TDR)以提取与复杂3D结构关联的电路模型。多端口结构的时域响应用于提取等效电路参数,以通过使用基于多端口时域反射(TDR)的通用反卷积算法来表征多端口。给出了耦合的互连和传输线的示例以说明该技术。

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