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Thermal oxidative degradation of ethylene tetrafluoroethylene copolymer systems.

机译:乙烯四氟乙烯共聚物体系的热氧化降解。

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Thermo-oxidative degradation of ethylene tetrafluoroethylene (ETFE) was investigated to determine how modifications for use in an electrical wire system affected its thermal stability. Modifications included electron irradiation and subsequent cross-linking during manufacture and contact with a metal surface. Samples with irradiation histories between 0 and 48 MRads were investigated. Degradation of ETFE was enhanced by contact with a metal "conductor" surface: silver - coated copper. Polymer degradation was analyzed by weight loss kinetics (thermogravimetric analysis (TGA)), changes in polymer morphology (differential scanning calorimetry (DSC)), optical microscopy, attenuated total reflectance (ATR) infrared spectroscopy, and gas chromatography - mass spectroscopy (GC/MS). Conductor aging (copper permeation through silver with subsequent oxidation) was investigated using scanning Auger Electron Spectroscopy (AES). Conductor aging is enhanced in the presence of the polymer surface. Interactions between conductor and polymer were analyzed by optical microscopy, scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS).; The rate of polymer degradation from 220°C to 280°C was independent of time and extent of degradation, and rate was proportional to irradiation dose. The activation energy for degradation of unirradiated ETFE was 227 kJ/mol and decreased from 150 to 138 kJ/mol for ETFE irradiated to doses between 6 and 48 MRads. Rates of degradation at 300°C to 320°C were dependent on the extent of degradation. Rates of degradation at temperatures between 230°C and 310°C were an order of magnitude larger in the presence of a conductor than in its absence, and activation energies for degradation in the presence of conductor were reduced to 120 kJ/mol. Degradation was modeled as the combination of bulk polymer degradation and catalytic degradation at the polymer-metal interface. ETFE aged at 250°C in the presence or absence of a conductor exhibited a double melting endotherm. ATR spectra of aged ETFE indicated polymer oxidation. Based on AES experiments, copper permeation during aging in the presence or absence of ETFE was consistent with Fickian diffusion. The coefficient for copper diffusion through silver was approximately 10 -15 cm2/second, and catalytic ETFE degradation was proportional to conductor aging. The copper oxidized on the surface to yield a material with a stoichiometric composition of Cu3O 2.
机译:研究了乙烯四氟乙烯(ETFE)的热氧化降解,以确定用于电线系统的改性如何影响其热稳定性。修改包括电子辐照以及随后在制造过程中以及与金属表面接触时的交联。研究了辐射历史介于0和48 MRads之间的样品。通过与金属“导体”表面:涂银的铜接触,可增强ETFE的降解。通过失重动力学(热重分析(TGA)),聚合物形态变化(差示扫描量热法(DSC),光学显微镜,衰减全反射率(ATR)红外光谱和气相色谱-质谱(GC /多发性硬化症)。使用扫描俄歇电子能谱(AES)研究了导体老化(铜渗透通过银并随后氧化)的过程。在聚合物表面的存在下,导体老化得以增强。导体和聚合物之间的相互作用通过光学显微镜,扫描电子显微镜(SEM)和能量色散光谱(EDS)进行分析。从220℃到280℃的聚合物降解速率与降解时间和降解程度无关,并且速率与辐照剂量成正比。未辐照的ETFE降解的活化能为227 kJ / mol,辐照剂量为6到48 MRads的ETFE的活化能从150降低到138 kJ / mol。 300℃至320℃下的降解速率取决于降解程度。在230℃至310℃之间的温度下,存在导体时的降解速率比不存在导体时的降解速率大一个数量级,并且在存在导体时用于降解的活化能降低至120kJ / mol。降解被建模为本体-聚合物界面处本体聚合物降解和催化降解的组合。在存在或不存在导体的情况下,在250°C时效的ETFE表现出双重熔融吸热。老化的ETFE的ATR光谱表明聚合物被氧化。根据AES实验,在存在或不存在ETFE的情况下,老化过程中的铜渗透与Fickian扩散一致。铜在银中的扩散系数约为10 -15 cm2 /秒,催化ETFE降解与导体老化成正比。铜在表面上氧化,生成化学计量组成为Cu3O 2的材料。

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