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Resource constrained heat sink optimization.

机译:资源受限的散热器优化。

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摘要

There exist several different paradigms to optimize the thermal management of electronic components. The present effort seeks to develop methodologies that enable least-material optimization, and design for sustainability, manufacturability, and thermo-economics, and provide a framework for their integration. The requisite microprocessor heat dissipation has been most often achieved via a heat sink (fin structure), with or without a fan. The design of such heat sinks is the focus of this thesis.; Existing single fin mass minimization techniques pioneered by A. D. Kraus, were extended to design optimal multiple-fin least-material arrays, for forced and natural convection air-cooling. A thermal Total Coefficient-of-Performance (COPT), relating the cooling capability of the heat sink to the energy invested in both its creation and operation, was used to determine the degree of sustainability of specific heat sink designs. Least-energy optimization was carried out to maximize the COPT, and this approach was combined with the classical Entropy Generation Minimization method.; Information gathered from industry was used identify manufacturing process limitations, and was combined with theoretical relations to construct work and cost models. The data and the models were subsequently utilized, to maximize the thermal performance capability of each process, and evaluate some of them with respect to sustainability and thermo-economics. The forced convection computations were performed using a well-validated analytical model from literature, while analytical models were constructed to characterize the thermal performance of the natural convection plate and pin fin arrays.; The least-material optimization was successfully applied as a heat sink design heuristic. An expression was derived for the optimal lateral spacing of isothermal staggered cylindrical pin arrays in natural convection. The least-energy optimization revealed the existence of an optimal work allocation ratio, for forced convection, that represented the most beneficial distribution of a fixed amount of input energy between pumping power and heat sink creation, over a given product life cycle. For the design space explored, both the bonded and folded fin processes were found to be best for the COPT metric. On considering a broader set of metrics, the folded fin designs were seen to the best process.
机译:存在几种不同的范例来优化电子组件的热管理。当前的工作旨在开发能够实现最少材料优化的方法论,并为可持续性,可制造性和热经济学进行设计,并为它们的集成提供框架。必需的微处理器散热通常是通过带有或不带有风扇的散热器(散热片结构)实现的。这种散热器的设计是本文的重点。由A. D. Kraus开创的现有单翅片质量最小化技术已扩展到设计最佳的多翅片最小材料阵列,用于强制和自然对流空气冷却。使用热总性能系数(COP T )将散热器的冷却能力与在其产生和运行中投入的能量相关联,来确定比热的可持续性程度水槽设计。进行了最小能量优化以使COP T 最大化,并且该方法与经典的熵产生最小化方法相结合。从行业收集的信息用于识别制造过程的局限性,并与理论关系相结合以构建工作和成本模型。随后利用数据和模型,以最大化每个过程的热性能,并就可持续性和热经济学方面对其中一些进行评估。强制对流计算是使用文献中经过充分验证的分析模型进行的,而分析模型的构建是为了表征自然对流板和针翅阵列的热性能。最少的材料优化已成功应用于散热器设计启发式算法。得出了自然对流中等温交错圆柱销阵列的最佳横向间距的表达式。最低能耗的优化揭示了强制对流的最佳功分配比的存在,这代表了在给定的产品生命周期中,固定功率输入能量在泵浦功率和散热器产生之间的最有利分配。对于所探索的设计空间,发现粘合和折叠翅片工艺都最适合COP T 度量。在考虑更广泛的度量标准时,折叠式鳍设计被认为是最佳过程。

著录项

  • 作者单位

    University of Minnesota.;

  • 授予单位 University of Minnesota.;
  • 学科 Engineering Mechanical.; Engineering Packaging.
  • 学位 Ph.D.
  • 年度 2003
  • 页码 253 p.
  • 总页数 253
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;包装工程;
  • 关键词

  • 入库时间 2022-08-17 11:45:19

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