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Acoustical imaging using capacitive micromachined ultrasonic transducer arrays: Devices, circuits, and systems.

机译:使用电容微机械超声换能器阵列的声像:设备,电路和系统。

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摘要

Integrated circuit technologies have had a great impact on the development of medical devices. Diagnostic imaging systems have benefited tremendously from the improvements in integrated circuits. One of the recent examples of this interaction between the two disciplines occurred in the area of ultrasonic imaging. The ability to build structures with dimensions in the submicron range enabled the realization of an almost a century old idea: Capacitive ultrasonic transducers. The major advantages of this transducer technology are ease of fabrication, potential for integration with supporting electronic circuits and improved bandwidth and sensitivity.; This dissertation analyzes the viability of capacitive micromachined ultrasonic transducers (CMUTs) for practical imaging applications. This analysis is conducted by a detailed characterization effort, and by demonstrating both 2-D and 3-D images. Acoustical performance of 1-D and 2-D CMUT arrays fabricated using silicon integrated circuit technology has been experimentally characterized for transmit and receive modes, and the results are found to be in good agreement with the theoretical expectations. Both 2-D and 3-D images have been demonstrated. The distinctive features of CMUTs manifest themselves in the results of the characterization experiments and also in the resulting images.; This dissertation also describes a general approach to design integrated front-end circuits for ultrasonic imaging and demonstrates basic circuit blocks for use in integrated systems along with CMUT arrays. The integration of the ultrasonic transducer arrays with supporting electronics not only reduces the cost and complexity of the system but also provides several advantages such as reduced parasitics, improved sensitivity, and a compact design with a reduced number of external interconnects. In this study, a custom integrated circuit comprising a pulse driver, a transmit/receive (T/R) switch and a wideband preamplifier has been fabricated in a 0.25-mum CMOS process and wire-bonded to a 320-mum x 320-mum CMUT for pulse-echo operation. Preliminary results on this system have shown that placing the T/R electronics close to the transducer improves the sensitivity and preserves the wide bandwidth of CMUTs.; The results obtained in this research indicate that CMUT technology has the potential to be the next-generation transducer technology for future ultrasonic imaging systems.
机译:集成电路技术对医疗设备的发展产生了重大影响。诊断成像系统已从集成电路的改进中受益匪浅。这两个学科之间这种相互作用的最新例子之一发生在超声成像领域。构建具有亚微米范围尺寸的结构的能力实现了近一个世纪的创意:电容式超声换能器。这种换能器技术的主要优点是易于制造,与支持电子电路集成的潜力以及改进的带宽和灵敏度。本文分析了电容微机械超声换能器在实际成像中的可行性。通过详细的表征工作以及演示2D和3D图像来进行此分析。已经对通过硅集成电路技术制造的1-D和2-D CMUT阵列的声学性能进行了传输和接收模式的实验表征,发现结果与理论预期非常吻合。 2-D和3-D图像均已演示。 CMUT的独特特征在表征实验的结果以及所得的图像中得以体现。本文还介绍了一种设计用于超声成像的集成前端电路的通用方法,并演示了与CMUT阵列一起用于集成系统的基本电路模块。超声换能器阵列与支持电子设备的集成不仅降低了系统的成本和复杂性,而且还提供了许多优势,例如减少了寄生现象,提高了灵敏度以及减少了外部互连件的数量。在这项研究中,定制的集成电路由脉冲驱动器,发射/接收(T / R)开关和宽带前置放大器组成,采用0.25微米CMOS工艺制成,并引线键合至320微米x 320微米CMUT用于脉冲回波操作。该系统的初步结果表明,将T / R电子设备靠近换能器可以提高灵敏度并保留CMUT的宽带宽。这项研究获得的结果表明,CMUT技术有可能成为未来超声成像系统的下一代换能器技术。

著录项

  • 作者

    Oralkan, Omer.;

  • 作者单位

    Stanford University.;

  • 授予单位 Stanford University.;
  • 学科 Engineering Electronics and Electrical.; Physics Acoustics.
  • 学位 Ph.D.
  • 年度 2004
  • 页码 222 p.
  • 总页数 222
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;声学;
  • 关键词

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