Process development and optimization by simulations for the packaging of advanced optoelectronic devices.

摘要

The next challenge in optical communications is to provide stable and high coupling efficiency optoelectronic devices in high yield, mass quantities at lower costs. Packaging process remains a bottleneck for the cost-effective manufacturing of the optoelectronic devices. The design parameters in the process development are numerous. It is difficult and time consuming to determine experimentally the respective contribution of each of the many parameters in the process development on packaging yield or package reliability, if it is possible. The objective of this work is to present the process development for packaging of the advanced optoelectronic devices by numerical method of finite element simulation.; Welding-induced-alignment-distortion (WIAD) is a serious issue in packaging of fiber-optic devices using laser welding and may significantly affect the packaging yield. A successful laser welding process should be able to minimize the WIAD. In this research, a physics based laser-material interaction model is set up and is applied in the attachment process of the laser diode module packages. The process parameters of laser welding sequence, laser pulse shape and weld clip design with their influence on the WIAD of the butterfly laser module packages are investigated. The study of the effect of welding sequence on WIAD of the dual-in-line laser module packages is also introduced.; The crack of substrate and the delamination of the interfaces are the two common failure modes of the advanced low cost overmolded flip chip (OM-FC) packages. A systematic stress analysis is introduced to investigate the reliability issues of the OM-FC packages in the attachment processes. The critical stress in the low cost substrate and the interfacial stresses at the die/underfill and die/mold-compound interfaces are studied. Parametric study is introduced to examine the effect of various combinations of the parameters relate to materials properties, package geometries and processes on the package reliability.