首页> 外文学位 >Silver, Gold, Palladium Nanoparticles: Ligand Design, Synthesis and Polymer Composites.
【24h】

Silver, Gold, Palladium Nanoparticles: Ligand Design, Synthesis and Polymer Composites.

机译:银,金,钯纳米粒子:配体设计,合成和聚合物复合材料。

获取原文
获取原文并翻译 | 示例

摘要

Metal nanoparticles, especially gold nanoparticles (AuNPs), have been extensively studied due to their interesting optical properties and potential applications in emerging technologies like drug delivery, cancer therapy, catalysis, chemical and bio-sensing and microelectronics devices. Alkyl thiol ligands in the form of self assembled monolayers are often used to stabilize and functionalize the gold nanoparticles while other types of ligands have been rarely employed and the properties of AuNPs protected by different types of ligands have not been studied comprehensively and comparatively.;This dissertation reports the first comparative studies on the thermal and chemical stability of AuNPs protected by alkyl thiolates, alkyl selenolates, dialkyl dithiophosphinates, and dialkyl dithiophosphates (Chapters 2 and 3). AuNPs protected by dialkyl dithiophosphinates and dialkyl dithiophosphates are unprecedented. All AuNPs were prepared from amine protected precursor AuNPs by ligand exchange to ensure similar size, size distribution, and chemical composition. They were extensively characterized by solution 1H-NMR and UV-VIS spectroscopy, transmission electron microscopy (TEM), thermal analysis, X-ray photoelectron spectroscopy (XPS), and X-ray diffraction (XRD) analysis. For the first time, thermal stability was investigated by differential scanning calorimetry (DSC) that provided more accurate decomposition temperatures and enthalpies, whereas chemical stability was tested as the availability of the gold surface towards etching with cyanide in different solvents.;Surprisingly, alkyl selenolate protected AuNPs are thermally less stable than alkyl thiolate protected AuNPs despite their proposed stronger binding to the gold surface and a much more crystalline monolayer, which suggests that different decomposition mechanisms apply to alkyl thiolate and alkyl selenolate protected AuNPs. Dialkyl dithiophosphinates and dialkyl dithiophosphates protected AuNPs are thermally least stable, although dialkyl dithiophosphates bind as bi-dentate ligands and are most stable towards cyanide etching. In contrast, dialkyl dithiophosphinates show mixed mono- and bi-dentate binding that generates loosely packed monolayers of low degree of crystallinity.;Another part of this thesis (Chapter 4 and 5) employs AuNPs and silver particles as fillers to improve the electrical and thermal conductivities of polyurethane composites. High anisotropic electrical conductivity of thin composite films are obtained after curing at unprecedentedly low gold contents, which is reasoned with the coagulation of AuNPs to conductive gold networks in domains of high concentration of AuNPs.;Silver particles and flakes of sizes between 20 nm and 1.5 micron were dispersed in polyurethane to investigate the effect of their size, morphology, aggregation, and dispersion on the thermal conductivity of the composites. Unexpectedly, composites filled with micron sized silver particles outperformed those filled with silver nanoparticles in thermal conductivity and stability.;Finally, PdNPs were synthesized in the presence of thiolate ligands of different conical bulk (single phase surfactant free approach) to study the influence of the different ligands on their size (Chapter 6). No systematic effect was observed in contrast to a similar study on AuNPs, which is reasoned with a weaker binding of ligands to the Pd surface.
机译:金属纳米颗粒,特别是金纳米颗粒(AuNPs),由于其有趣的光学特性和在新兴技术中的潜在应用而进行了广泛研究,这些新兴技术包括药物输送,癌症治疗,催化,化学和生物传感以及微电子设备。自组装单分子层形式的烷基硫醇配体通常用于稳定和官能化金纳米颗粒,而很少使用其他类型的配体,并且尚未全面,比较地研究由不同类型配体保护的AuNP的性能。论文报道了有关烷基硫醇盐,烷基亚硒酸酯,二烷基二硫代次膦酸酯和二烷基二硫代磷酸酯保护的AuNP的热稳定性和化学稳定性的第一个比较研究(第2章和第3章)。由二烷基二硫代次膦酸酯和二烷基二硫代磷酸酯保护的AuNP是前所未有的。所有的AuNP都是通过配体交换由胺保护的前体AuNP制备的,以确保相似的尺寸,尺寸分布和化学组成。通过溶液1H-NMR和UV-VIS光谱,透射电子显微镜(TEM),热分析,X射线光电子能谱(XPS)和X射线衍射(XRD)分析对其进行了广泛表征。首次通过差示扫描量热法(DSC)研究了热稳定性,它提供了更准确的分解温度和焓,而化学稳定性被测试为金表面可在不同溶剂中用氰化物进行蚀刻的可用性。尽管被保护的AuNPs与烷基硫醇盐保护的AuNPs相比具有更高的热稳定性,尽管它们提议与金表面的结合力更强,并且具有更大的结晶单层,这表明对硫醇酸烷基酯和硒代烷酸烷基酯保护的AuNPs具有不同的分解机理。尽管二烷基二硫代磷酸酯作为双齿配体结合并且对氰化物蚀刻最稳定,但是二烷基二硫代次膦酸酯和二烷基二硫代磷酸酯保护的AuNP在热稳定性方面最差。相比之下,二硫代次膦酸二烷基酯显示出单齿和双齿的混合键合,从而产生了低结晶度的松散堆积的单分子层。本论文的另一部分(第4章和第5章)采用AuNPs和银颗粒作为填料来改善电学和热学。聚氨酯复合材料的电导率。在空前低的金含量下固化后,复合薄膜具有很高的各向异性电导率,这是由于AuNPs在高浓度AuNPs区域内凝结成导电金网络所致;银颗粒和薄片尺寸在20 nm至1.5之间微米分散在聚氨酯中,以研究其尺寸,形态,聚集和分散对复合材料导热性的影响。出乎意料的是,填充有微米级银颗粒的复合材料在导热性和稳定性方面优于填充有银纳米颗粒的复合材料;最后,在存在不同锥形体积的硫醇盐配体的情况下合成了PdNPs(无单相表面活性剂方法),研究了PdNP的影响。不同大小的配体(第6章)。与类似的关于AuNPs的研究相反,没有观察到系统的影响,这是由于配体与Pd表面的结合较弱所致。

著录项

  • 作者

    Iqbal, Muhammad.;

  • 作者单位

    University of Windsor (Canada).;

  • 授予单位 University of Windsor (Canada).;
  • 学科 Chemistry Inorganic.;Nanoscience.;Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2012
  • 页码 252 p.
  • 总页数 252
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号