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Evaluation of the indium gallium nitride/silicon broken-gap heterojunction and its potential application for solar cells.

机译:氮化铟镓/硅断裂间隙异质结的评估及其在太阳能电池中的潜在应用。

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摘要

InGaN (especially In-rich alloy) has been actively studied for decades since the band gap of InN was revised downward from ∼2.0 eV to 0.64 eV. The potential applications for alloys of In-rich InGaN hence became apparent. Despite the promising potential, photovoltaic devices based on InGaN have struggled due to a number of key limitations and fundamental physical problems. Firstly, due to the deep excursion of the InN conduction band at the gamma point, defects in InN are almost universally n-type leading to unintentional degenerate doping. This also leads to the problem of electron accumulation at all surfaces and interfaces of InN. Secondly, p-type doping is problematic, partially due to the degenerate doping effect of defects, but it has also been observed that Mg-doping, while leading to a p-type layer, dramatically reduces the quantum efficiency.;This thesis explores an alternative approach using n-type InGaN to form a heterojunction with a p-type Si substrate. One potential benefit to using p-type Si as a substrate material for InGaN is that the valence band of Si possibly lines up with the conduction band of InGaN for a specific mole fraction of indium. Such a band alignment is known as a broken gap heterojunction, an example of which is the interface between InAs and AlxGa 1–xSb. The benefits of this broken-gap junction include a low series resistance, high electron mobility, and mobility only weakly dependent on temperature. These properties enable new approach to photovoltaic devices.;The InGaN/Si heterojunctions were fabricated by plasma-assisted molecular beam epitaxy under stoichiometric flux conditions. An ultra-thin SiN interface layer was introduced, by Si nitridation process, to passivate the substrate surface and prevent In-Si and Ga-Si eutectic problems. InGaN films with a variety of indium mole fractions were grown by calibrating the In/Ga flux ratio during the deposition. The chemical composition of as-grown films was characterized by x-ray diffraction. Subsequently, the selected films with indium mole fraction close to 44% were measured by xray photoemission spectroscopy to determine the valence band offset at the InGaN and Si interface. The XPS measured valence band offset of 1.85 eV showed an excellent agreement with the theoretical prediction (1.83 eV), obtained from the branch point energy model, indicating the formation of broken-gap alignment.
机译:自从InN的带隙从约2.0 eV向下修正为0.64 eV以来,InGaN(尤其是富In的合金)已被积极研究了数十年。因此,In-InGaN合金的潜在应用变得显而易见。尽管潜力无限,但基于InGaN的光伏器件仍存在许多关键局限性和基本物理问题,因此仍在努力。首先,由于InN导带在伽玛点处的深偏移,InN中的缺陷几乎普遍为n型,从而导致无意的简并掺杂。这也导致电子在InN的所有表面和界面上积累的问题。其次,p型掺杂是有问题的,部分原因是由于缺陷的退化掺杂效应,但是也已经观察到,Mg掺杂虽然会导致p型层,但是却大大降低了量子效率。另一种方法是使用n型InGaN与p型Si衬底形成异质结。使用p型Si作为InGaN的衬底材料的一个潜在好处是,对于铟的特定摩尔分数,Si的价带可能与InGaN的导带对齐。这样的能带排列被称为裂隙异质结,InAs与AlxGa 1-xSb之间的界面就是一个例子。这种能隙间隙结的好处包括低串联电阻,高电子迁移率以及迁移率仅微弱地依赖于温度。这些性质为光电器件提供了新的方法。InGaN / Si异质结是在化学计量通量条件下通过等离子体辅助分子束外延制造的。通过氮化硅工艺引入了超薄的氮化硅界面层,以钝化衬底表面并防止In-Si和Ga-Si共晶问题。通过在沉积过程中校准In / Ga通量比,可以生长出具有多种铟摩尔分数的InGaN膜。通过X射线衍射表征成膜的化学组成。随后,通过X射线光发射光谱法测量所选择的铟摩尔分数接近44%的膜,以确定在InGaN和Si界面处的价带偏移。 XPS测得的价带偏移为1.85 eV,与从分支点能量模型获得的理论预测值(1.83 eV)高度吻合,表明形成了裂隙排列。

著录项

  • 作者

    Yao, Yuan.;

  • 作者单位

    State University of New York at Buffalo.;

  • 授予单位 State University of New York at Buffalo.;
  • 学科 Engineering Electronics and Electrical.;Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2013
  • 页码 167 p.
  • 总页数 167
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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