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Characterization of the Copper-Silicon System and Utilization of Metallurgical Techniques in Silicon Refining for Solar Cell Applications.

机译:铜-硅系统的表征和冶金技术在太阳能电池硅精炼中的利用。

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摘要

Two methods for refining metallurgical grade silicon to solar grade silicon have been investigated. The first method involved the reduction of impurities from metallurgical grade silicon by high temperature vacuum refining. The concentrations of analyzed elements were reduced several times. The main steps in the second refining method include alloying with copper, solidification, grinding and heavy media separation. A metallographic study of the Si-Cu alloy showed the presence of only two microconstituents, mainly pure silicon dendrites and the Cu3Si intermetallic. SEM analysis showed a distinct boundary between the silicon and the Cu3Si phases, with a large concentration of microcracks along the boundary, which allowed for efficient separation. After alloying and grinding, a heavy media liquid was used to separate the light silicon phase from the heavier Cu3Si phase. Cu3Si residues together with the remaining impurities were found to be located at the surface of the pure silicon particles, and should be efficiently removed by acid leaching. Thirty elements were analyzed by the Inductively Coupled Plasma Mass Spectrometry (ICP) chemical analysis technique. ICP revealed a several times higher impurity level in the Cu3Si intermetallic than in the pure silicon; furthermore, the amounts of 22 elements in the refined silicon were reduced below the detection limit where the concentrations of 7 elements were below 1ppmw and 6 elements were below 2ppmw. The results showed that the suggested method is efficient in removing impurities from metallurgical grade silicon with great potential for further development.
机译:研究了两种将冶金级硅提炼为太阳能级硅的方法。第一种方法涉及通过高温真空精炼来减少冶金级硅中的杂质。分析元素的浓度降低了数倍。第二种精炼方法的主要步骤包括与铜合金化,固化,研磨和重介质分离。对Si-Cu合金的金相研究表明,仅存在两种微成分,主要是纯硅树枝晶和Cu3Si金属间化合物。 SEM分析显示出硅相和Cu3Si相之间有明显的边界,沿边界存在大量微裂纹,可以有效分离。合金化和研磨后,使用重介质液体将轻质硅相与重质Cu3Si相分离。发现Cu3Si残留物以及剩余的杂质位于纯硅颗粒的表面,应通过酸浸有效去除。通过电感耦合等离子体质谱法(ICP)化学分析技术分析了30种元素。 ICP显示,Cu3Si金属间化合物中的杂质含量是纯硅中的几倍;此外,精制硅中22种元素的含量减少到检测限以下,其中7种元素的浓度低于1ppmw,6种元素的浓度低于2ppmw。结果表明,该方法可有效去除冶金级硅中的杂质,具有进一步开发的潜力。

著录项

  • 作者

    Mitrasinovic, Aleksandar.;

  • 作者单位

    University of Toronto (Canada).;

  • 授予单位 University of Toronto (Canada).;
  • 学科 Engineering Metallurgy.;Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2010
  • 页码 232 p.
  • 总页数 232
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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