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Determination of Oriented Strandboard properties from a three-dimensional density distribution using the finite element method.

机译:使用有限元方法从三维密度分布确定定向Strandboard属性。

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摘要

Computer modeling of Oriented Strand Board (OSB) properties has gained widespread attention with numerous models created to better understand OBS behavior. Recent models allow researchers to observe multiple variables such as changes in moisture content, density and resin effects on panel performance. Thickness-swell variation influences panel durability and often has adverse effects on a structural panel's bending stiffness. The prediction of out-of-plane swell under changing moisture conditions was, therefore, the essence for developing a model in this research.; The finite element model accounted for both vertical and horizontal density variations, the three-dimensional (3D) density variation of the board. The density variation, resulting from manufacturing processes, affects the uniformity of thickness-swell in OSB and is often exacerbated by continuous sorption of moisture that leads to potentially damaging internal stresses in the panel. The overall thickness-swell (the cumulative swell from non-uniform horizontal density profile, panel swell from free water, and spring-back from panel compression) was addressed through the finite element model in this research.; The pursued goals in this study were, first and foremost, the development of a robust and comprehensive finite element model which integrated several component studies to investigate the effects of moisture variation on the out-of-plane thickness-swell of OSB panels, and second, the extension of the developed model to predict panel stiffness. It is hoped that this paper will encourage researchers to adopt the 3D density distribution approach as a viable approach to analyzing the physical and mechanical properties of OSB.
机译:定向绞线板(OSB)属性的计算机建模已受到广泛关注,其创建了许多模型以更好地了解OBS行为。最近的模型允许研究人员观察多个变量,例如水分含量,密度的变化以及树脂对面板性能的影响。厚度-膨胀变化会影响面板的耐用性,并且通常会对结构面板的弯曲刚度产生不利影响。因此,在不断变化的湿度条件下对平面外膨胀的预测是开发本研究模型的本质。有限元模型考虑了垂直和水平密度变化,即电路板的三维(3D)密度变化。由制造工艺引起的密度变化会影响OSB中厚度膨胀的均匀性,并且经常由于不断吸收水分而加剧,从而可能破坏面板的内部应力。整体厚度膨胀(非均匀水平密度分布的累积膨胀,自由水的面板膨胀和面板压缩产生的回弹)通过本研究中的有限元模型解决。这项研究的追求目标首先是开发一个强大而全面的有限元模型,该模型整合了多个成分研究,以研究水分变化对OSB板面外厚度膨胀的影响,其次是,已开发模型的扩展以预测面板刚度。希望本文能够鼓励研究人员采用3D密度分布方法作为分析OSB物理和机械性能的可行方法。

著录项

  • 作者

    Tackie, Alan Derek Nii.;

  • 作者单位

    The University of Tennessee.;

  • 授予单位 The University of Tennessee.;
  • 学科 Engineering Civil.; Agriculture Wood Technology.; Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2006
  • 页码 250 p.
  • 总页数 250
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 建筑科学;森林采运与利用;工程材料学;
  • 关键词

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