Optimization for finite element modeling of electronic components under dynamic loading.

摘要

Usage of electronic components in the U.S. ARMY applications is becoming more challenging due to their usage in harsh environments. Experimental verification of these components is expensive and it can yield information about specific locations only. This research outlines the finite element modeling methodology for these electronic components that are subjected to high acceleration loads that occur over extremely short time such as impact, gun firing and blast events. Due to their miniature size these finite element models are computationally expensive. An optimization engine was presented to have an efficient analysis procedure that provides a combination of accuracy, computational speed and modeling simplicity. This research also involves experimental testing of the electronic components mounted on the circuit boards. Testing was conducted at different strain levels in order to study the behavior of boards. Finite element models were developed for these tests and compared with experimental results.