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Software architecture for high data rate wireless body sensor applications.

机译:高数据速率无线人体传感器应用程序的软件架构。

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摘要

For wireless body area sensor networks, the wearable nodes are highly constrained by low power, low cost, and small size while deliverly high throughput and low latency in a multiple access environment. To accomplish these goals, the hardware must be kept simple, and as a result, the traditional abstractions with separate layers of the protocol stack and application must be merged and made as streamlined as possible. This dissertation identifies and removes two bottlenecks with data transfers: one is between the base station and its sensor nodes, and the other is within the sensor node. First, we propose a thin-server, fat-client architecture. It supports a pulling protocol that achieves intra-network collision-free multiple access as in TDMA but without the time synchronization overhead. It also achieves high data throughput of air bandwidth and adaptivity of CSMA protocols but without collision or complexity on the node side. Second, for infra-node transfers, another known bottleneck is the system bus. We identify the double-transaction problem, which is common to SPI, DMA, and other interfaces. We propose the Master-Handoff Protocol to eliminate the redundant transaction and improve latency significantly, and it is compatible with existing controllers. It not only halves the data transfer time but also achieves energy reduction. Together, these techniques enable highly constrained hardware to meet strict size and power constraints for high wearability without sacrificing performance.
机译:对于无线人体区域传感器网络,可穿戴节点受到低功耗,低成本和小尺寸的高度限制,同时在多址访问环境中提供高吞吐量和低延迟。为了实现这些目标,必须使硬件保持简单,因此,必须合并具有协议堆栈和应用程序单独层的传统抽象,并使其尽可能简化。本文确定并消除了数据传输的两个瓶颈:一个在基站与其传感器节点之间,另一个在传感器节点内。首先,我们提出了瘦服务器胖客户端架构。它支持一种拉协议,该协议可实现与TDMA一样的网络内无冲突多路访问,但没有时间同步开销。它还实现了空中带宽的高数据吞吐量和CSMA协议的适应性,但在节点侧没有冲突或复杂性。其次,对于节点下传输,另一个已知的瓶颈是系统总线。我们确定了双向事务问题,这是SPI,DMA和其他接口常见的问题。我们提出了主切换协议,以消除冗余事务并显着改善延迟,并且与现有控制器兼容。它不仅将数据传输时间缩短了一半,而且还降低了能耗。总之,这些技术使高度受限的硬件能够满足严格的尺寸和功率限制,从而在不牺牲性能的情况下实现高耐磨性。

著录项

  • 作者

    Yoo, Seung Mok.;

  • 作者单位

    University of California, Irvine.;

  • 授予单位 University of California, Irvine.;
  • 学科 Engineering Electronics and Electrical.Computer Science.
  • 学位 Ph.D.
  • 年度 2007
  • 页码 100 p.
  • 总页数 100
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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