THE BOND VALENCE METHOD - APPLIED TO COMPLEX THIOANIONS AND HETEROBIMETALLIC COMPLEXES OF COPPER WITH MOLYBDENUM AND TUNGSTEN VIA BRIDGING SULFUR LIGANDS

摘要

By applying the bond valence model to complex thioanions [TO_nS_(4-n)]~(2-) (T = Mo W), thiocuprate anions [CuS]~- and [Cu_2S_3]~(4-) as well as some heterobimetallic cluster anions of these metals it is shown that interesting information on the bonding and charge distribution in these compounds can be obtained by very simple calculations.