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Interconnect Modeling Using Integrated Time-Domain and Frequency-Domain Techniques

机译:使用集成时域和频域技术的互连建模

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摘要

This paper presents an integrated time-and-frequency-domain technique for characterization and modeling of parasitic effects associated with interconnects. This technique enables direct measurements of critical transient as well as frequency responses of interconnects; accurate and efficient SPICE model extraction for coupled lines; and cross-domain verification of the measured data as well as the extracted models. To illustrate its application this technique is applied to characterize and extract the equivalent circuit model of the I/O bus on a real-world printed circuit board.
机译:本文提出了一种集成的时域和频域技术,用于表征和建模与互连相关的寄生效应。这种技术可以直接测量关键瞬变以及互连的频率响应。准确有效地提取耦合线的SPICE模型;对测量数据以及提取的模型进行跨域验证。为了说明其应用,该技术用于表征和提取实际印刷电路板上I / O总线的等效电路模型。

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