【24h】

RELIEF HOLES FOR STRESS MITIGATION IN INFINITE THIN PLATE WITH SINGLE CIRCULAR HOLE LOADED AXIALLY

机译:轴向加载单圆孔的无限薄板应力缓解的释放孔

获取原文
获取原文并翻译 | 示例

摘要

The stress concentration factor in an infinite thin plate with single circular hole, loaded axially is approximately 3. The reason of this high stress is explained through stress flow lines, similar to stream lines in a ideal fluid flow around a circular obstacle. Various methods for stress mitigation have been reported in literature. In the case considered it can also be reduced by removing material from the vicinity. In the present work the removal of the material, introduction of two smaller relief holes, is proposed in such a way that the stress flow lines will follow an elliptical path and thus reducing the stress concentration effect. The size of the relief holes and center distance between the holes are formulated for minimizing the stress concentration effect. The problem is analyzed using FEA software ANSYS. The result is encouraging in a way that for a particular circular singularity the size of the relief hole and center distance is formulated for minimizing the stress concentration factor.
机译:轴向上有单个圆形孔的无限薄板中的应力集中系数大约为3。这种高应力的原因是通过应力流线解释的,类似于理想流体在圆形障碍物周围的流线。文献中已经报道了多种缓解压力的方法。在考虑的情况下,也可以通过从附近移除材料来减少这种情况。在当前的工作中,提出了去除材料的方法,即引入了两个较小的泄压孔,使得应力流线将遵循椭圆形路径,从而降低了应力集中效应。释放孔的大小和孔之间的中心距离的制定是为了最大程度地减小应力集中效应。使用FEA软件ANSYS对问题进行了分析。结果令人鼓舞,对于特定的圆形奇异点,制定了卸压孔的大小和中心距以最小化应力集中系数。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号