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Electrically Measurable Test Structures to Capture and Classify EUV Stochastics

机译:可电气测量的测试结构,可捕获和分类EUV随机变量

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摘要

Advanced technology nodes are demanding aggressive printability using EUV. EUV printing process inherently bringsin stochastic defects. To measure and experience various types of Stochastics in EUV printing, high volumemeasurements are deemed necessary. Furthermore the classification of the defects in terms of stochastic and systematicis also required. The permutation and combinations of shapes, sizes, and proximity driven stochastics errors are high innumbers, leading to significant increase in the number of test structures needed. Without electrically measurablesolutions, the defect test measurement exercise becomes impractical to perform visually. This paper will describe fewexamples of developing and handling the test structures capable to capture the defects and defect location and further toclassify the defects in terms of stochastic or systematic defects.
机译:先进的技术节点要求使用EUV进行主动打印。 EUV打印过程固有地带来了\ n \ n随机缺陷。为了在EUV打印中测量和体验各种类型的随机变量,认为必须进行大量测量。此外,还需要按照随机的和系统的\ r \ nis分类缺陷。形状,大小和邻近性驱动的随机误差的排列和组合的数量很高,从而导致所需测试结构数量的显着增加。没有电气可测量的解决方案,缺陷测试测量练习就无法在视觉上执行。本文将描述一些开发和处理能够捕获缺陷和缺陷位置并进一步按照随机或系统缺陷对缺陷进行分类的测试结构的示例。

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  • 来源
    《Extreme Ultraviolet (EUV) Lithography X》|2019年|109571M.1-109571M.11|共11页
  • 会议地点 1996-756X;0277-786X
  • 作者单位

    IMEC, Department of logic technologies, Kapeldreef 75, Heverlee 3001, Belgium;

    IMEC, Department of logic technologies, Kapeldreef 75, Heverlee 3001, Belgium;

    IMEC, Department of logic technologies, Kapeldreef 75, Heverlee 3001, Belgium;

    IMEC, Department of logic technologies, Kapeldreef 75, Heverlee 3001, Belgium;

    IMEC, Department of logic technologies, Kapeldreef 75, Heverlee 3001, Belgium;

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