High Speed electronics

摘要

The conference saw the presentation of several key results in wideband electronics, with particular emphasis on optical fiber communication ICs. Realization of compact & robust chip sets for fiber transmission at 20 to 40 Gb/s rates is a competitive arena, the contending technologies being submicron silicon bipolar, GaAs/AlGaAs and InGaAs/InP heterojunction bipolar, and even ion-implanted GaAs MESFETS.