首页> 外文会议>TMS(The Minerals, Metals amp; Materials Society) Annual Meeting; 20040314-20040318; Charlotte,NC; US >Wear of Silicon Nitride Bonded SiC Bricks in Aluminium Electrolysis Cells
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Wear of Silicon Nitride Bonded SiC Bricks in Aluminium Electrolysis Cells

机译:铝电解槽中氮化硅粘结的SiC砖的磨损

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Samples from a sidewall of an aluminium electrolysis cell were submitted for study of the wear mechanism of the Si_3N_4 bonded SiC-brick. Samples were studied using a combination of chemical analysis, microscopy, SEM-EDS and powder-XRD. Unused bricks from two suppliers were used as reference materials. The unused bricks are very similar. Differences are found in the grain size of the SiC and in the binder (β-Si_3N_4 content varies between bricks in also internally in individual samples). All bricks have a coarse matrix and higher porosity in the core. The wear mechanism of the bricks seems a combination of attack by Na, HF, oxidation and moisture. Below bath level oxidation and Na play a major role but bricks are least altered. At bath level attack is severe but observations were complicated through a repair, which caused secondary reactions in addition to oxidation. Above bath level the bricks disintegrate but reaction products are almost absent. Here we hypothesize that HF-vapor transformed the oxidation products into volatile fluorides and other gases. This study shows that the corrosion tests currently used for Si_3N_4 bonded SiC-bricks, do not simulate the wear mechanism described in this paper. In order to evaluate the performance of these bricks it is important to develop a new corrosion test, where water, Na, HF and oxidation play a role.
机译:提交了铝电解槽侧壁的样品,以研究Si_3N_4键合的SiC砖的磨损机理。结合化学分析,显微镜,SEM-EDS和粉末XRD对样品进行了研究。来自两个供应商的未使用的砖用作参考材料。未使用的砖非常相似。在SiC的晶粒尺寸和粘合剂中发现差异(β-Si_3N_4的含量在各个样品的砖中也有所不同)。所有砖块的基体都比较粗糙,孔隙率较高。砖的磨损机制似乎是Na,HF,氧化和湿气侵蚀的结合。在浴液以下,氧化和钠起主要作用,但砖的变化最少。在浴池处,侵蚀很严重,但通过维修观察却很复杂,除氧化外还引起了次要反应。在浴液高度以上,砖会崩解,但几乎没有反应产物。在这里,我们假设HF蒸气将氧化产物转化为挥发性氟化物和其他气体。这项研究表明,目前用于Si_3N_4键合SiC砖的腐蚀测试不能模拟本文所述的磨损机理。为了评估这些砖的性能,重要的是开发一种新的腐蚀测试,其中水,Na,HF和氧化起着重要的作用。

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