首页> 外文会议>Third International Conference on Solid State Lighting; Aug 5-7, 2003; San Diego, California, USA >Advanced Technologies for high efficiency GaInN LEDs for solid state lighting
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Advanced Technologies for high efficiency GaInN LEDs for solid state lighting

机译:用于固态照明的高效GaInN LED的先进技术

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Solid state lighting has seen a rapid development over the last decade. They compete and even outperform ligth sources like incandescent bulbs and halogen lamps. LEDs are used in applications where brightness, power consumption, reliability and costs are key parameters as automotive, mobile and display applications, In the future LEDs will also enter the market of general lighting. For all of these new applications highly efficient, scalable and cost efficient technologies are required. These targets can be matched by SiC based flip chip LEDs which enable the design of high current chips with efficiencies of up to 28 lm/W in white solderable packages. An alternative approach is the implementation of thinfilm technology for GalnN. The LED is fabricated by transferring the epilayers with laser lift off from sapphire to a GaAs host substrate. In combination with efficient surface roughening and highly reflective p-mirror metallisation an extraction efficiency of 70% and wall plug efficiency of 24% at 460nm have been shown. The chips showed 16mW@ 20mA with an Voltage of 3.2V. The technology is scalable from small size LEDs to high current Chips and is being transferred to mass production.
机译:在过去的十年中,固态照明发展迅速。它们竞争甚至超越白炽灯泡和卤素灯之类的光源。 LED用于亮度,功耗,可靠性和成本是汽车,移动和显示应用等关键参数的应用,将来,LED还将进入通用照明市场。对于所有这些新应用,都需要高效,可扩展且具有成本效益的技术。这些目标可以与基于SiC的倒装芯片LED相匹配,该LED能够在白色可焊接封装中设计高达28 lm / W的高电流芯片。一种替代方法是为GalnN实施薄膜技术。通过将带有蓝宝石的激光剥离的外延层从蓝宝石转移到GaAs主体衬底上来制造LED。与有效的表面粗糙化和高反射率的p镜金属化相结合,在460nm处的提取效率为70%,壁塞效率为24%。芯片显示出16mW @ 20mA的电压为3.2V。该技术可从小尺寸LED扩展到大电流芯片,并正在转入批量生产。

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