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Enhanced Drain Current Ripple Variation with Vertical and Horizontal Electrical Fields under Optical Illumination

机译:光学照明下垂直和水平电场的增强漏极电流纹波变化

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摘要

For logic MOSFET (metal-oxide-semiconductor filed effect transistor), the drain current usually depends on applied drain and gate voltages. A continuous-wave (CW) laser-crystallized (CLC) single-grainlike polycrystalline silicon (polysilicon) thin-film transistor (poly-Si TFT) also represents the similar electric characteristics with the mentioned device. Recently, poly-Si n-TFTs had been researched and successfully fabricated by C. Chen's team [1]. This TFT device demonstrates the excellent electron mobility, up to 530 cm~2/V-s greater than that with low-temperature poly-silicon (LTPS) fabrication technology. In general, the TFT device is directly exposed by light from backside light source and outside light source beyond the display screen. Using some illuminants shining on the CLC poly-Si TFT, such as light emitting diode (LED), the current-voltage (I-V) characteristic of the TFT shows a current-ripple phenomenon. These interesting ripples actually may be magnified by the supplied drain and gate voltages. In this work, the red color LED was employed and the supplied drain and gate voltages were 0~ 7 V and 1 ~ 5 V, respectively.
机译:对于逻辑MOSFET(金属氧化物半导体场效应晶体管),漏极电流通常取决于施加的漏极和栅极电压。连续波(CW)激光晶化(CLC)单晶状多晶硅(poly-Si TFT)薄膜也表现出与上述器件相似的电特性。最近,C。Chen的团队研究并成功制造了多晶硅n-TFT [1]。该TFT器件具有出色的电子迁移率,比采用低温多晶硅(LTPS)制造技术的电子迁移率高出530 cm〜2 / V-s。通常,TFT装置直接被来自背面光源和外部光源的光暴露于显示屏之外。使用某些在CLC多晶硅TFT上发光的光源,例如发光二极管(LED),TFT的电流-电压(I-V)特性会显示出电流纹波现象。这些有趣的纹波实际上可能会被所提供的漏极和栅极电压放大。在这项工作中,采用红色LED,并且提供的漏极和栅极电压分别为0〜7 V和1〜5V。

著录项

  • 来源
    《Thin Film Transistors 9 (TFT 9)》|2008年|93-102|共9页
  • 会议地点 Honolulu HI(US)
  • 作者单位

    Institute of Mechatronic Engineering, National Taipei University of Technology, Taipei, 10601, Taiwan Dept. of Electronic Engineering, Ming-Hsin University of Science and Technology, No. 1 Hsin-Hsing Road, Hsin-Fong, Hsin-Chu, 304, Taiwan;

    Institute of Mechatronic Engineering, National Taipei University of Technology, Taipei, 10601, Taiwan;

    Dept. of Electronic Engineering, Ming-Hsin University of Science and Technology, No. 1 Hsin-Hsing Road, Hsin-Fong, Hsin-Chu, 304, Taiwan;

    Department of Material Science Engineering, National Chiao Tung University, Hsinchu, 300, Taiwan;

    National Nano Device Laboratories, Hsinchu 30078, Taiwan;

    Department of Material Science Engineering, National Chiao Tung University, Hsinchu, 300, Taiwan;

    Dept. of Electronic Engineering, Ming-Hsin University of Science an;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 表面处理;
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